Lukas Valentin Hof, M. Sc.
- Doctoral Researcher
- Simulation Additive Manufacturing
- Research Group:
Formfüllsimulation
- Room: 126
CO 70.04 - Phone: +49 721 608-45385
- lukas hof ∂ kit edu
Rintheimer Querallee 2
Building 70.04, Campus East
76131 Karlsruhe
Publications
pyGCodeDecode: A Python package for time-accurate GCode simulation in material extrusion processes
Knirsch, J.; Frölich, F.; Hof, L.; Wittemann, F.; Kärger, L.
2024. Journal of Open Source Software, 9 (99), Art.-Nr.: 6465. doi:10.21105/joss.06465
Knirsch, J.; Frölich, F.; Hof, L.; Wittemann, F.; Kärger, L.
2024. Journal of Open Source Software, 9 (99), Art.-Nr.: 6465. doi:10.21105/joss.06465
Entwicklung eines Simulationsmodells zur Strangablage in der Materialextrusion mit der Smoothed Particle Hydrodynamics Methode. master’s thesis
Hof, L.
2022, November 2. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000172570
Hof, L.
2022, November 2. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000172570
Homogenization of the Anisotropic Thermal Conductivity of Mesostructures in Material Extrusion
Hof, L.; Frölich, F.; Wittemann, F.; Kärger, L.
2024, July 2. 21st European Conference on Composite Materials (ECCM 2024), Nantes, France, July 2–5, 2024
Hof, L.; Frölich, F.; Wittemann, F.; Kärger, L.
2024, July 2. 21st European Conference on Composite Materials (ECCM 2024), Nantes, France, July 2–5, 2024
Design concept of a repairable YASA axial flux machine with a hybrid cooling system
Schäfer, A.; Baranowski, M.; Springmann, M.; Hof, L.; Frölich, F.; Peter, A.; Parspour, N.; Fleischer, J.; Middendorf, P.; Kärger, L.; Michalowski, A.
2023. 12th International Conference on Power Electronics, Machines and Drives (PEMD 2023), 119–128, Institution of Engineering and Technology (IET). doi:10.1049/icp.2023.1987
Schäfer, A.; Baranowski, M.; Springmann, M.; Hof, L.; Frölich, F.; Peter, A.; Parspour, N.; Fleischer, J.; Middendorf, P.; Kärger, L.; Michalowski, A.
2023. 12th International Conference on Power Electronics, Machines and Drives (PEMD 2023), 119–128, Institution of Engineering and Technology (IET). doi:10.1049/icp.2023.1987